Technical Program to Help Engineers Gain Better Understanding of Measurements to Determine Properties of Low-loss Materials in High-frequency Applications
Anritsu Company (DesignCon booth #501) announces its VectorStar(TM) Vector Network Analyzer (VNA) will be part of a workshop conducted by DuPont Circuit & Packaging Materials (DuPont) (booth #719) and Rogers Corporation (booth #720), as part of the DesignCon Technical program. The workshop on understanding the properties of low-loss materials in high-frequency applications will include live demonstrations in which the VectorStar will conduct various tests on thin, flexible materials from DuPont and thick, rigid materials from Rogers.
Workshop presenters are Glenn Oliver, Senior Engineer, DuPont Circuit & Packaging Materials, and John Coonrod, Market Development Manager, Rogers Corporation. The two engineers are the Chair and Vice-Chair, respectively, of the IPC D-24C Task Group for IPC, which is focused on developing and standardizing high-frequency measurement methods for printed circuit board (PCB) materials. The workshop will be from 1:30-4:30 p.m. today in Grand Ballroom F of the Santa Clara Convention Center, site of DesignCon 2014.
"We are happy to support this interactive workshop and look forward to the live demonstrations that focus on the microwave properties of materials. This is a very important subject in the signal integrity field and the unique design of the VectorStar makes the VNA platform well suited for this type of demonstration," said Wade Hulon, General Manager and Vice President of Anritsu Company.
At DesignCon 2014, DuPont will highlight DuPont(TM) Pyralux(®) flexible circuit materials as part of its innovative product portfolio that enables next-generation designs for computers, handheld devices and the infrastructure that connects the cloud. DuPont Circuit & Packaging Materials offers a broad and growing portfolio of products, including dry film photoresists and phototooling films for Printed Circuit Board (PCB) imaging, polyimide films, flexible circuit materials, embedded passive materials and thermal substrates for LED lighting.