Designed for medium performance applications, the solvent-based adhesive enables production efficiency with good wettability on aluminium and metallized films.
Dow (NYSE: DOW) expands its portfolio of solvent-based adhesives with the new ADCOTETM L76-500 high-solids adhesive, opening new opportunities beyond traditional metal-to-film lamination. Designed to work on a broad range of medium performance applications and packaging structures, the innovative adhesive offers up to 55 percent high solids content in application, enabling converters to improve production efficiency and lamination speed while reducing energy costs and emissions.
“Converters operate in an increasingly competitive market, facing material and processing cost pressures,” said Izzat Midani, marketing manager EMEA at Dow Packaging and Specialty Plastics. “With the new ADCOTETM high-solids adhesive we are providing our customers the opportunity to boost their competitiveness in the market with an efficient yet sustainable solution.”
ADCOTETM L76-500 high-solids adhesive is designed for medium performance applications such as stand-up pouches for condiments and sauces and personal care packaging. Its unique properties make it suitable for a broad range of packaging structures such as laminates with metallized films, aluminium foil, OPA, PET, barrier films, as well as triplex and quadruplex compositions with PE and cPP. Showing good wettability on most demanding films and excellent solvent release during drying, the new adhesive enables high lamination speeds up to 400mpm for an enhanced production processing and output.
“With the new ADCOTETM high-solids adhesive, Dow delivers on specific customer requirements with sustainable production in mind,” said Daniele Vinci, application technology leader adhesives EMEA at Dow Packaging & Specialty Plastics. “The high solid content in application of the new adhesive enables low solvent emissions and reduced energy costs. In addition, the low monomer content qualifies it for an H351 free label and delivers a balanced PAA1 decay, while being free of Bisphenol A.”
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