Atmel teams up with SMARTRAC leveraging Atmel's RFID ATA5575M2 and Smart-Glass-Tags to deliver High-Performance RFID Identification Capability
Atmel teams up with SMARTRAC leveraging Atmel's RFID ATA5575M2 and Smart-Glass-Tags to deliver High-Performance RFID Identification Capability
EnGenius DuraFon PRO allows key personnel ability to maintain efficient, reliable communications throughout assisted living, senior living communities
Schreiner ProTech at IZB 2014 in Wolfsburg, Hall 1/1108
From October 14 - 16 Schreiner ProTech will be showcasing its portfolio for the automotive industry at the International Suppliers Fair (IZB) in Wolfsburg: RFID labels for metallic substrates, self-adhesive venting systems for efficient ventilation of component housings, protective films for simple processing operations, as well as film-integrated conductors for touch panels. Schreiner ProTech also makes appropriate printers, readers and dispensing systems available to its customers to ensure optimal integration into existing process chains.
Smaller closures meet industry need for simple, reusable and reliable weatherproofing closures
Super Mobility Week (Booth #2644) – 3M Communication Markets Division today announced two new Slim Lock Closures for wireless weatherproofing of smaller RF connections at the cell site. The 3M™ Slim Lock Mini and the 3M™ Slim Lock Nano join the 3M™ Slim Lock Classic, creating a family of varying sizes for wireless weatherproofing needs. The closures offer a re-enterable weatherproofing solution that installs in less than a minute using just one hand, helping to reduce time and simplify install for tower hands.
The PL 30000 RFID Personalization Line will be unveiled during Labelexpo Americas 2014. Mühlbauer's (booth 6406) new universal platform solution now enables fully automated high speed chip encoding and print personalization of RFID labels and tickets (on reel and Z-fold) in one fully integrated system.
RF430F5978 MCU integrates TI sub-1GHz RF transceiver, 3D LF wake-up trigger and transponder with standard MSP430 MCU features and advanced AES security
Expanding its broad portfolio of low-power, radio frequency (RF) solutions, Texas Instruments (TI) (NASDAQ: TXN) today introduces the RF430F5978 microcontroller (MCU) and accompanying evaluation module (EVM). Building on TI's CC430 product family, the RF430F5978 MCU is a highly integrated RF solution with improved read zone and battery performance for ultra-low power applications.
Company Launches New, Intrinsically Safe Active Tag Supporting IEEE Standard to Promote Interoperability
Omni-ID, the original inventor of the on-metal tag and leading global supplier of high-performance, RFID tags and visual tagging systems has announced its support for the IEEE 802.15.4f-2012 standard to increase interoperability for asset tracking using active RFID based tags and systems. The company today also announced that it has developed an active tag operating on this standard -- the Power 415.
Next Generation Devices Deliver 5% Increase in Efficiency
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the launch of its ninth generation (Gen9) LDMOS RF power transistors for wireless/cellular base stations. These ground-breaking devices represent a further step-up in performance for LDMOS transistors, having shown up to 5% more efficiency in Doherty applications. The first Gen9 transistors are designed for Doherty power amplifiers – symmetric and asymmetric – and offer benchmark power densities in existing high-volume packages. The Gen9 technology is also optimized for operation at 3.4-3.8 GHz in anticipation of these frequency bands being released on a global scale next year for use by mobile telecoms providers. NXP will showcase its first Gen9 products at IMS 2014 (booth 1733).
Legacy of plastic packaging innovation for wireless infrastructure equipment continues with an industry first for harsh industrial environments
Continuing its long track record of RF power technology leadership, Freescale Semiconductor (NYSE: FSL) introduces its first plastic packaged devices designed specifically for high ruggedness applications. The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the industry's first > 65:1 VSWR rated devices to be housed in over molded plastic packaging.
New programmable, highly integrated modulator, demodulator and dual-mixer simplify design in 3G/4G communications, military/aerospace and instrumentation equipment applications.
First integrated RF power development system reduces complexity of RF application creation with portable, multi-functional instrumentation capabilities
Freescale Semiconductor (NYSE: FSL), the leading provider of RF power technology, today introduced the RF Power Tool system, which is designed to simplify the development of RF power applications and help customers create new and differentiated RF power solutions.
Offering the Most Comprehensive Portfolio of RF, Microwave and Millimeter Wave Solutions that Includes Wideband and Low Noise Amplifiers and Switches for a Broad Range of Applications
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its entry into the monolithic microwave integrated circuit (MMIC) market space.
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