SCREEN Holdings has recently developed the LeVina, a next-generation direct imaging system for high-definition patterning, in line with the major changes in advanced packaging, where the megatrend is shifting to "digital x green". LeVina will be available from April 2022.
In recent years, there has been a growing demand for higher performance in IC package substrate technology to meet the growing demands of DX (Digital Transformation), green technology and other social issues. In order to achieve higher performance, finer patterning is essential, and there is a growing need in the IC package substrate industry for direct writing systems that can achieve both high resolution and high productivity.
Against this backdrop, we have combined the Ledia series, which has been installed in more than 600 units worldwide as a direct lithography system for IC package substrates, with a lithography head equipped with a proprietary GLV optical engine and laser control technology based on an optical system developed over many years. This has resulted in the development of the LeVina, the next generation direct imaging system for patterns with the world's highest resolution of 5µm. The use of a high-speed stage that moves 480mm per second and a scan alignment function enables high-speed mass production of 100 wafers per hour at a resolution of 5μm line and space.
As well as accelerating business development in the ever-expanding package substrate market, particularly for 5G/post-5G related and IoT infrastructure, Screen will continue to meet the various needs of the semiconductor packaging industry and contribute to its development.
