BARplast will showcase its latest products, including AURUM®, a Thermoplastic Polyimide (TPI) from Mitsui Chemicals, PBI, PIs Thermosetting Polyimide, and PEEK, during the event.
AURUM® is a high-performance thermoplastic with Properties such as low outgasing, high purity, excellent tribological properties, compounds can help prevent particle contamination and achieve more reliable wafer handling, storage and transfer. AURUM®
is used in the semiconductor industry for sealing ICs, wafer bonding, manufacturing test sockets, and as a substrate element for high-performance PCBs. Its reliability, durability, and exceptional performance make AURUM® a sought-after Polymer in demanding electronic applications. This innovative Polyimide has a glass transition temperature (Tg) of 245°C (473°F) making it perfect for demanding applications in hot environments.
Polybenzimidazole (PBI) is a thermoplastic polymer. This material is characterized by a glass transition temperature of 800 °F and a broad chemical resistance.
In the Semiconductor industry, the thermoplastics can be used as retaining rings, screws, feeder rings, wafer handling, wafer spin chucks, furnace ring holders, focus rings, wafer clamps, vacuum pads, and wafer carriers.
Thermosetting Polyimide series manufactured by DAELIM PLAVIS Co. Ltd., offers dimensional stability at high temperatures and is a versatile choice because it is lighter than metals and more flexible than ceramics. It finds successful applications in wafer processing and features ultra-clean composition, low outgassing, low dielectric constant, easy machinability, and very high distortion temperature. The High-purity of this Polyimide makes it an ideal choice for various Semicon applications.
BARplast also offers several grades of PEEK compounds, which has proven to be compelling Polymers in the semiconductor industry. Thanks to their higher wear resistance, CMP rings made of PEEK can run up to twice as long as PPS before they need to be replaced.